SOLID Assembly March 2024

Hosted by DTU, the event featured notable presentations and discussions.

Michael Stuckelberg from DESY presented on Multi-modal scanning X-ray microscopy: from material properties to nanoscopic solar-cell performance, and introduced the RIANA project (remade-project.eu).

Despite Prof Per Hensen's absence, attendees enjoyed a tour of the 3D Imaging Centre led by Henning Friis Poulsen and Sina Baier-Stegmaier.

Jacob Sauer, researcher at DTU, introduced the Core Imaging Library (CIL) and CUQIpy for Uncertainty quantification for Inverse problems in Python.

Joost Batenburg from Leiden University remotely presented on Dark field STEM microscopy for electron detection.

The event had a Faraday discussions session, where PhD students had to present for 5 min their research papers, followed by 25 min Q&A session.

The PhD students and their presentations were during both days of the event:

• Albert Zelenika
  3D Microstructural and Strain Evolution During the Early Stages of Tensile Deformation
• Aditya Shukla
  Grain boundary strain localization in CdTe solar cell revealed by Scanning 3D X-ray diffraction microscopy
• Maja Østergaard
  A systematic study of the effect of measurement parameters on determination of osteocyte lacunar properties using laboratory X-ray micro-computed tomography
• Cédric Holme Qvistgaard
  Polarized Neutron Imaging of Current Induced Magnetic Fields in Superconducting Multifilamentary YBCO Tape
• Erik Hillo Lørup
  Searching for pseudoisomorphs with MD simulations
• Domenico Battaglia
  Neutron imaging as a powerful tool to investigate electrolyte degradation and plating mechanisms in sodium ion batteries
• Estrid Buhl Naver
  Phase contrast neutron imaging compared to wave propagation- and McStas simulations
  
   

During the second day of the event, Robin Woracek from ESS discussed Multiscale Multimodal Full Field Characterization employing Neutron Imaging and plastic deformations in Fe.

Pablo Perez, from Lund University presented X-ray multi-projection imaging, and explained the multi-scale wood analysis with beamline technologies.

The SOLID Assembly March 2024 served as a platform for innovation and collaboration in imaging and material analysis, promising future advancements in the field.